Union Semiconductor (Hefei) Co., Ltd. provides high-end advanced packaging and testing services for integrated circuits in China. The company offers front-end gold bumps, wafer bumps, wafer testing, back-end chip-on-glass packaging, film-on-chip packaging, tape and reel chip package, and turnkey packaging and testing services for driver integrated circuits. Its products are used in TVs, laptops, mobile phones, tablets, digital cameras, and other consumer electronics. The company was founded in 2011 and is headquartered in Hefei, China.