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JCET Group Co., Ltd. provides integrated-circuit manufacturing and technology services worldwide. The company offers wafer level packaging, system-in-packaging, flip chip, and wire bonding products for various semiconductor applications, such as mobile, communication, compute, consumer, automotive, industry, etc. It also provides design and characterization, research and development, wafer probe, water bump, package assembly, shipment, and test services. The company was formerly known as Jiangsu Changjiang Electronics Technology Co., Ltd. and changed its name to JCET Group Co., Ltd. in November 2019. JCET Group Co., Ltd. was founded in 1972 and is based in Jiangyin, China.