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WenYi Trinity Technology Co., Ltd researches and develops molds and equipment technology for the semiconductor and chemical building materials industries in China and internationally. The company provides semiconductor integrated circuits packaging molds and equipment, plastic profile extrusion molds and equipment, belt conveyor idler bearing housings, seals, etc. The company was formerly knowns as Tongling Zhongfa Sanjia Technology Co., Ltd. and changed its name to WenYi Trinity Technology Co., Ltd in 2011. WenYi Trinity Technology Co., Ltd was founded in 2000 and is based in Tongling, China.